An additional advantage of underfill is that it limits tin whisker growth.
2.
Traditionally, lead was added to slow down whisker growth in tin-based solders.
3.
Whisker growth is even observable for lead-based solders, albeit on a much smaller scale.
4.
An example of a conductor which exhibits whisker growth due to electromigration is shown in the figure below:
5.
Fortunately, experience thus far suggests deployed instances of RoHS compliant products are not failing due to whisker growth.
6.
Further testing under a standard temperature-humidity cycling showed tin whisker growth, raising additional reliability and safety concerns.
7.
The mechanism behind whisker growth is not well understood, but seems to be encouraged by compressive mechanical dendrites in several respects.
8.
Schematic illustration of metal-alloy catalyzed whisker growth depicting the pathway of source materials through the droplet to the growing interface.
9.
Failure of the primary control processor was attributed to tin whisker growth, a phenomenon in which tendrils grow from solder, causing an electrical short circuit.
10.
As the growth continues, the inclination angle at the base of the nanowires ( ?, set as zero before whisker growth ) increases, as does ? 0:
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